VIGON® PE 215N is a water-based, pH-neutral cleaning agent designed to reliably remove flux residues from power electronics components, particularly power modules and DCBs after die attach or heat-sink soldering. Its MPC® Technology provides excellent material compatibility, effective rinsing and clean, activated copper surfaces suitable for subsequent wire bonding, molding or adhesive bonding. It is primarily formulated for spray-in-air cleaning systems but may also be used in ultrasonic dip-tank equipment.